Ceramic materials are widely used in various electronic components due to their excellent high-temperature resistance, corrosion resistance, insulation properties, and thermal stability. Their applications not only enhance the performance of electronic components but also promote the miniaturization, reliability, and durability of electronic products.
Ceramic Substrates
Principle: Ceramic substrates serve as carriers for semiconductor devices, providing good thermal conductivity, insulation, and mechanical strength. They effectively dissipate heat and ensure stable circuit operation.
Materials: Common ceramic materials used for substrates include aluminum oxide (Al₂O₃), aluminum nitride (AlN), and zirconium oxide (ZrO₂).
Application Scenarios: These substrates are widely utilized in power electronic modules, LED chip packaging, and integrated circuits, significantly improving heat dissipation and enhancing system reliability.
Ceramic Capacitors
Principle: Ceramic capacitors utilize ceramic materials as dielectrics, allowing for relatively high capacitance values in compact volumes.
Materials: Commonly used ceramic materials include aluminum oxide (Al₂O₃), which has a high dielectric constant, enabling higher capacitance.
Application Scenarios: Ceramic capacitors are extensively used in smartphones, computers, and automotive electronic devices, particularly suited for filtering and bypassing functions in high-frequency circuits.
